Lithography

Design technology co-optimization assessment for directed self-assembly-based lithography: design for directed self-assembly or directed self-assembly for design?

[+] Author Affiliations
Kafai Lai, Chi-Chun Liu, Hsinyu Tsai, Yongan Xu, Cheng Chi, Jaime Morillo, Jed Pitera, Kristin Schmidt, Mike Guillorn, Markus Brink, Daniel Sanders, Nelson Felix, Matthew Colburn

IBM Corporation, IBM Research Division, Yorktown Heights, New York, United States

Ananthan Raghunathan, Parul Dhagat, Lin Hu, Oseo Park, Todd Bailey

GlobalFoundries Inc., Hopewell Junction, New York, United States

Sunggon Jung, Wooyong Cho

Samsung Electronics Corp., Hopewell Junction, New York, United States

J. Micro/Nanolith. MEMS MOEMS. 16(1), 013502 (Feb 07, 2017). doi:10.1117/1.JMM.16.1.013502
History: Received November 19, 2016; Accepted January 12, 2017
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Abstract.  We report a systematic study of the feasibility of using directed self-assembly (DSA) in real product design for 7-nm fin field effect transistor (FinFET) technology. We illustrate a design technology co-optimization (DTCO) methodology and two test cases applying both line/space type and via/cut type DSA processes. We cover the parts of DSA process flow and critical design constructs as well as a full chip capable computational lithography framework for DSA. By co-optimizing all process flow and product design constructs in a holistic way using a computational DTCO flow, we point out the feasibility of manufacturing using DSA in an advanced FinFET technology node and highlight the issues in the whole DSA ecosystem before we insert DSA into manufacturing.

© 2017 Society of Photo-Optical Instrumentation Engineers

Citation

Kafai Lai ; Chi-Chun Liu ; Hsinyu Tsai ; Yongan Xu ; Cheng Chi, et al.
"Design technology co-optimization assessment for directed self-assembly-based lithography: design for directed self-assembly or directed self-assembly for design?", J. Micro/Nanolith. MEMS MOEMS. 16(1), 013502 (Feb 07, 2017). ; http://dx.doi.org/10.1117/1.JMM.16.1.013502


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