Evaluation of alignment accuracy for nano-imprint lithography

Kazuya Fukuhara; Masaki Mitsuyasu; Ryo Ogawa; Katsuya Abe; Anupam Mitra; Sachiko Kobayashi; Satoshi Mitsugi; Motofumi Komori; Takuya Kono

doi:10.1117/12.2614407

13 June 2022 Evaluation of alignment accuracy for nano-imprint lithography

Kazuya Fukuhara, Masaki Mitsuyasu, Ryo Ogawa, Katsuya Abe, Anupam Mitra, Sachiko Kobayashi, Satoshi Mitsugi, Motofumi Komori, Takuya Kono

Author Affiliations +

Proceedings Volume PC12054, Novel Patterning Technologies 2022; PC120540B (2022) https://doi.org/10.1117/12.2614407
Event: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States

Abstract

Nano-imprint lithography (NIL) tool for semiconductor manufacturing employs die-by-die alignment system. For semiconductor device manufacturing, precise alignment of template mark and wafer mark that is composed of various film stacks, is required to achieve good overlay accuracy. We have studied the relation of wafer stack structure and NIL alignment accuracy. Using FPA-1200NZ2C (Canon Corp.), we have evaluated imprint performance on the wafers with different stacks. In this paper, we describe (i) alignment performance of the state-of-the art NIL tool, (ii) simulation of NIL alignment mark signal, and (iii) capability of NIL alignment system for various wafer stack structure.

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Citation Download Citation

Kazuya Fukuhara, Masaki Mitsuyasu, Ryo Ogawa, Katsuya Abe, Anupam Mitra, Sachiko Kobayashi, Satoshi Mitsugi, Motofumi Komori, and Takuya Kono "Evaluation of alignment accuracy for nano-imprint lithography", Proc. SPIE PC12054, Novel Patterning Technologies 2022, PC120540B (13 June 2022); https://doi.org/10.1117/12.2614407

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