Advanced Approaches To Focal Plane Integration

Richard D. Nelson; Elroy C. Smith Jr.

doi:10.1117/12.958479

7 May 1980 Advanced Approaches To Focal Plane Integration

Richard D. Nelson, Elroy C. Smith Jr.

Proceedings Volume 0217, Advances in Focal Plane Technology; (1980) https://doi.org/10.1117/12.958479
Event: 1980 Los Angeles Technical Symposium, 1980, Los Angeles, United States

Abstract

Both visible and infrared focal plane assemblies have common architectural driving parameters which guide their design approaches. The key drivers for advanced focal plane assemblies (FPA) are: the detector type and performance required; the number of detector chips; the packaging density; and the geometry. The impact of these drivers is seen to determine the engineering compromises necessary to establish FPA design approach. Several new designs are discussed which show a range of applications from single detector assemblies to monolithic detector chips with on-chip signal processing. The main objective of many advanced designs is to integrate the focal plane components in order to reduce power and re-duce the number of interconnections. The next stage of integration may come with VLSI device developments.

Citation Download Citation

Richard D. Nelson and Elroy C. Smith Jr. "Advanced Approaches To Focal Plane Integration", Proc. SPIE 0217, Advances in Focal Plane Technology, (7 May 1980); https://doi.org/10.1117/12.958479

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