A Totally Aqueous Developable Bilayer Resist System

Mark P. de Grandpre; David A. Vidusek; Michael W. Legenza

doi:10.1117/12.947822

18 April 1985 A Totally Aqueous Developable Bilayer Resist System

Mark P. de Grandpre, David A. Vidusek, Michael W. Legenza

Proceedings Volume 0539, Advances in Resist Technology and Processing II; (1985) https://doi.org/10.1117/12.947822
Event: 1985 Microlithography Conferences, 1985, Santa Clara, United States

Abstract

An aqueous developable two layer resist system has been developed using a poly(dimethylglutarimide) (PMGI) based planarizing layer. This material offers better resistance to dry etching and thermally induced flow than PM M A. The PMGI layer is highly solvent resistant so no interfacial mixing with conventional positive resist top layers is observed. The pattern transfer exposure wavelengths for the PMGI are 240 - 280 nm. Dyes were added to the novolak based top layer to ensure optimum deep UV masking for thicknesses less than one micron.

Citation Download Citation

Mark P. de Grandpre, David A. Vidusek, and Michael W. Legenza "A Totally Aqueous Developable Bilayer Resist System", Proc. SPIE 0539, Advances in Resist Technology and Processing II, (18 April 1985); https://doi.org/10.1117/12.947822

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