Paper
18 April 1985 Silicon-Containing Resists For Bi-Layer Resist Systems
Y. Ohnishi, M. Suzuki, K. Saigo, Y. Saotome, H. Gokan
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Abstract
Several kinds of silicon-containing resist materials for bi-layer resist systems devel-oped in our' Laboratories are reported. For negative working resists, poly(trimethylsilylstyrene-co-chloromethylstyrene) ( P(SiSt-CMS) ) and a mixture of poly(triallylphenylsilane) with bisazide ( TAS ) have been developed. P(SiSt-CMS) was designed for EB or deep UV exposure. TAS suits to use in near UV lithographic tools. For positive working resists, SIPR (a partly trimethylsilyl-methylated resorcinol-formaldehyde resin mixed with naphthoquinonediazide) was developed. Syntheses, lithographic data and applications to bi-layer systems of these resists are given.
© (1985) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Y. Ohnishi, M. Suzuki, K. Saigo, Y. Saotome, and H. Gokan "Silicon-Containing Resists For Bi-Layer Resist Systems", Proc. SPIE 0539, Advances in Resist Technology and Processing II, (18 April 1985); https://doi.org/10.1117/12.947816
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Cited by 17 scholarly publications.
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KEYWORDS
Silicon

Deep ultraviolet

Etching

Near ultraviolet

Lithography

Bismuth

Polymers

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