Laser Processing For Application Specific Integrated Circuits (ASICs)

Donald V. Smart; Donald M. Stewart

doi:10.1117/12.940392

1 September 1987 Laser Processing For Application Specific Integrated Circuits (ASICs)

Donald V. Smart, Donald M. Stewart

Proceedings Volume 0774, Lasers in Microlithography; (1987) https://doi.org/10.1117/12.940392
Event: Microlithography Conferences, 1987, Santa Clara, CA, United States

Abstract

ASIC devices can be programmed by lasers using two techniques - a photochemical approach to direct-write connections or localized heating of the circuits by a laser spot to cut or form link structures. The technique to cut links is a mature process based on cutting similar link structures used to repair memory devices with redundant circuitry. The link-cutting process described here provides a 90% or higher programming yield on a 100,000 link ASIC based on specific process recommendations including optical verification of link cutting performance.

Citation Download Citation

Donald V. Smart and Donald M. Stewart "Laser Processing For Application Specific Integrated Circuits (ASICs)", Proc. SPIE 0774, Lasers in Microlithography, (1 September 1987); https://doi.org/10.1117/12.940392

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