Evaluation of anti-sticking layers performances for 200mm wafer scale Smart NILTM process through surface and defectivity characterizations

F. Delachat; J.-C. Phillipe; V. Larrey; F. Fournel; S. Bos; H. Teyssèdre; Xavier Chevalier; Célia Nicolet; Christophe Navarro; Ian Cayrefourcq

doi:10.1117/12.2298407

13 March 2018 Evaluation of anti-sticking layers performances for 200mm wafer scale Smart NIL^TM process through surface and defectivity characterizations

F. Delachat, J.-C. Phillipe, V. Larrey, F. Fournel, S. Bos, H. Teyssèdre , Xavier Chevalier, Célia Nicolet, Christophe Navarro, Ian Cayrefourcq

Author Affiliations +

Proceedings Volume 10586, Advances in Patterning Materials and Processes XXXV; 1058615 (2018) https://doi.org/10.1117/12.2298407
Event: SPIE Advanced Lithography, 2018, San Jose, California, United States

Abstract

In this work, an evaluation of various ASL processes for 200 mm wafer scale in the HERCULES® NIL equipment platform available at the CEA-Leti through the INSPIRE program is reported. The surface and adherence energies were correlated to the AFM and defectivity results in order to select the most promising ASL process for high resolution etch mask applications. The ASL performances of the selected process were evaluated by multiple working stamp fabrication using unpatterned and patterned masters though defectivity monitoring on optical based-inspection tools. Optical and SEM defect reviews were systematically performed. Multiple working stamps fabrication without degradation of the master defectivity was witnessed. This evaluation enabled to benchmark several ASL solutions based on the grafted technology develop by ARKEMA in order to reduce and optimize the soft stamp defectivity prior to its replication and therefore considerably reduce the final imprint defectivity for the Smart NIL process.

Citation Download Citation

F. Delachat, J.-C. Phillipe, V. Larrey, F. Fournel, S. Bos, H. Teyssèdre , Xavier Chevalier, Célia Nicolet, Christophe Navarro, and Ian Cayrefourcq "Evaluation of anti-sticking layers performances for 200mm wafer scale Smart NIL^TM process through surface and defectivity characterizations", Proc. SPIE 10586, Advances in Patterning Materials and Processes XXXV, 1058615 (13 March 2018); https://doi.org/10.1117/12.2298407

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