Paper
23 March 2020 Contribution ratio of process fidelity and beam accuracy in multi-beam mask writing
Rumi Ito, Yoshinori Kojima, Hiroshi Matsumoto
Author Affiliations +
Abstract
We investigated the contribution ratio of process fidelity and beam accuracy in patterning with the multi-beam mask writing system. A beam pitch-related line edge profile may occur, which impacts on line edge roughness (LER) in the multi-beam writing system. The printability of beam image into the final etched pattern depends on the mask process, therefore, we need to understand quantitatively the printability of beam placement errors on LER with the actual mask process. We examined how the patterning characteristics are modified in each step of the mask process. The printability of beam placement errors largely depend on the period of errors, rather than the amplitude of errors. These results can optimize the writing strategy in multi-beam mask writing.
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rumi Ito, Yoshinori Kojima, and Hiroshi Matsumoto "Contribution ratio of process fidelity and beam accuracy in multi-beam mask writing", Proc. SPIE 11324, Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020, 113241A (23 March 2020); https://doi.org/10.1117/12.2551847
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Line edge roughness

Spatial frequencies

Etching

Image processing

Photomasks

Chromium

Optical lithography

RELATED CONTENT


Back to Top