Paper
3 April 2020 Establishing a sidewall image transfer chemo-epitaxial DSA process using 193 nm immersion lithography
G. J. Rademaker, A. Le Pennec, T. J. Giammaria, K. Benotmane, H. Pham, C. Bouet, M. G. Gusmao Cacho, M. Argoud, M.-L. Pourteau, A. Paquet, A. Gharbi, C. Navarro, C. Nicolet, X. Chevalier, K. Sakavuyi, P. Nealey, R. Tiron
Author Affiliations +
Abstract
Directed Self-Assembly (DSA) of Block Copolymers (BCP) by chemo-epitaxial alignment is a promising high resolution lithography technique compatible with CMOS high-volume manufacturing. It allows overcoming limitations in resolution and local stochasticity by conventional, imaging based, lithography. However, for BCP with pitches below 20 nm and guide patterning by immersion lithography (193i), multiplication factors ≥ 4 become necessary, imposing stringent requirements on the guides and defectivity becomes hard to control. The Arkema-CEA (ACE) process flow overcomes this limit by creating the guides by a self-aligned double patterning (SADP) process flow, followed by the deposition of a cross-linkable neutral mat and selective grafting of the guides. This paper reports on the transfer of the process flow to immersion lithography, details challenges encountered in process optimization, notably the dependence of the wetting of the neutral layer on the surface energy and the morphology of the spacers. Last, the paper presents a metrology and defectivity roadmap combined with preliminary, promising results.
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
G. J. Rademaker, A. Le Pennec, T. J. Giammaria, K. Benotmane, H. Pham, C. Bouet, M. G. Gusmao Cacho, M. Argoud, M.-L. Pourteau, A. Paquet, A. Gharbi, C. Navarro, C. Nicolet, X. Chevalier, K. Sakavuyi, P. Nealey, and R. Tiron "Establishing a sidewall image transfer chemo-epitaxial DSA process using 193 nm immersion lithography", Proc. SPIE 11326, Advances in Patterning Materials and Processes XXXVII, 113260Z (3 April 2020); https://doi.org/10.1117/12.2552003
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KEYWORDS
Lithography

Metrology

Directed self assembly

Immersion lithography

Photomasks

Optical lithography

Etching

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