Holistic alignment approach for on-product overlay improvement on DUV lithography process with combined solutions

Jigang Ma; Miao Yu; Cees Lambregts; Sotirios Tsiachris; Paul Böcker; Jun-Yeob Kim; Won-Kwang Ma; Sang-Jun Han; Chan-Ha Park; Kyong-Seok Kim; Jung-Hwan Kim; Sang-Jun Park; Gwang-Gon Kim

doi:10.1117/12.2552938

23 March 2020 Holistic alignment approach for on-product overlay improvement on DUV lithography process with combined solutions

Jigang Ma, Miao Yu, Cees Lambregts, Sotirios Tsiachris, Paul Böcker, Jun-Yeob Kim, Won-Kwang Ma, Sang-Jun Han, Chan-Ha Park, Kyong-Seok Kim, Jung-Hwan Kim, Sang-Jun Park, Gwang-Gon Kim

Author Affiliations +

Proceedings Volume 11327, Optical Microlithography XXXIII; 113270S (2020) https://doi.org/10.1117/12.2552938
Event: SPIE Advanced Lithography, 2020, San Jose, California, United States

Abstract

In world-leading semiconductor manufacturing, the device feature size keeps on reducing and with it processes become more challenging in the next technology node. The on-product overlay budget is therefore required to reduce further. Alignment is one of the key factors in reducing overlay wafer-to-wafer variation. Due to the complexity, a holistic methodology is used to combine various alignment solutions to achieve the optimal on-product overlay performance. In this paper, we evaluated the holistic method by simulation and experiment for DUV layers. We illustrate the expected on-product overlay improvement.

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Citation Download Citation

Jigang Ma, Miao Yu, Cees Lambregts, Sotirios Tsiachris, Paul Böcker, Jun-Yeob Kim, Won-Kwang Ma, Sang-Jun Han, Chan-Ha Park, Kyong-Seok Kim, Jung-Hwan Kim, Sang-Jun Park, and Gwang-Gon Kim "Holistic alignment approach for on-product overlay improvement on DUV lithography process with combined solutions", Proc. SPIE 11327, Optical Microlithography XXXIII, 113270S (23 March 2020); https://doi.org/10.1117/12.2552938

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