A new generation EUV pellicle to enable future EUV lithographic nodes at enhanced productivity

Guido Salmaso; Raymond Maas

doi:10.1117/12.2600854

29 September 2021 A new generation EUV pellicle to enable future EUV lithographic nodes at enhanced productivity

Guido Salmaso, Raymond Maas

Proceedings Volume 11854, International Conference on Extreme Ultraviolet Lithography 2021; 118540R (2021) https://doi.org/10.1117/12.2600854
Event: SPIE Photomask Technology + EUV Lithography, 2021, Online Only

Abstract

With EUV lithography now a stable part of the chip Industry production processes, the attention and demand for higher productivity is more pressing than ever. To support customers' demands, ASML has developed the next generation EUV pellicle, increasing the EUV transmittance and lifetime standards. Thanks to its unparalleled performance, the new generation pellicle boosts the scanner productivity more than 20% compared to the previous one.

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Guido Salmaso and Raymond Maas "A new generation EUV pellicle to enable future EUV lithographic nodes at enhanced productivity", Proc. SPIE 11854, International Conference on Extreme Ultraviolet Lithography 2021, 118540R (29 September 2021); https://doi.org/10.1117/12.2600854

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KEYWORDS

Pellicles

Extreme ultraviolet

Extreme ultraviolet lithography

Lithography

Transmittance

Semiconducting wafers

Scanners

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