Presentation + Paper
1 December 2022 Mask process correction for laser writers
Ingo Bork, Kushlendra Mishra, Samarpita Mukherjee, Rachit Sharma, Mary Zuo
Author Affiliations +
Abstract
Photomasks for the semiconductor chip production are typically written with either laser- or e-beam writers. Laser tools have the advantage of fast writing speeds and are overall more cost effective than e-beam writers. On the other hand, ebeam writers achieve significantly better mask accuracy in terms of minimum Critical Dimension (CD) and CD uniformity. Despite the accuracy disadvantage of laser writers, on average, they account for approximately 70% of all masks delivered by the mask industry, during the years between 2018 and 2020. The widespread use of laser writers and their technical limitations make them excellent candidates for Mask Process Corrections (MPC). This work investigates the feasibility of using MPC, developed for e-beam writers, with minor modifications to laser writers. It will be shown that adding an anisotropic component to the models used for e-beam lithography is sufficient for simulating the laser tool signature. With such models, MPC provides an opportunity to expand the application space of laser tools into CD ranges, not possible without MPC and enables tool signature matching between mask writers similar to that used for e-beam writers.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ingo Bork, Kushlendra Mishra, Samarpita Mukherjee, Rachit Sharma, and Mary Zuo "Mask process correction for laser writers", Proc. SPIE 12293, Photomask Technology 2022, 122930J (1 December 2022); https://doi.org/10.1117/12.2641990
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KEYWORDS
Photomasks

Critical dimension metrology

Error analysis

Calibration

Data modeling

Etching

Laser processing

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