Cost analysis of device options and scaling boosters below the A14 technology node

G. Mirabelli; A. Vandooren; C. Roda Neve; V. V. Gonzalez; H. Mertens; A. Farokhnejad; P. Schuddinck; G. Murdoch; S. M. Salahuddin; O. Zografos; L. Ragnarsson; P. Weckx; Z. Tokei; G. Hellings; J. Ryckaert

doi:10.1117/12.2656456

28 April 2023 Cost analysis of device options and scaling boosters below the A14 technology node

G. Mirabelli, A. Vandooren, C. Roda Neve, V. V. Gonzalez, H. Mertens, A. Farokhnejad, P. Schuddinck, G. Murdoch, S. M. Salahuddin, O. Zografos, L. Ragnarsson, P. Weckx, Z. Tokei, G. Hellings, J. Ryckaert

Author Affiliations +

Proceedings Volume 12495, DTCO and Computational Patterning II; 124951K (2023) https://doi.org/10.1117/12.2656456
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Conference Poster

Abstract

The saturation in dimensional scaling has clearly impacted the semiconductor technology roadmap. The extension of patterning cliffs through new tools and multi-patterning lithography, as well as the introduction of innovative scaling boosters is helping in optimally scaling the Power-Performance-Area (PPA) metrics. However, because of the increase in the process complexity and reduced area benefits, manufacturing cost is increasing. Therefore, moving to a PPA-Cost (PPAC) methodology to monitor and analyze the cost of a technology is becoming increasingly necessary.

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G. Mirabelli, A. Vandooren, C. Roda Neve, V. V. Gonzalez, H. Mertens, A. Farokhnejad, P. Schuddinck, G. Murdoch, S. M. Salahuddin, O. Zografos, L. Ragnarsson, P. Weckx, Z. Tokei, G. Hellings, and J. Ryckaert "Cost analysis of device options and scaling boosters below the A14 technology node", Proc. SPIE 12495, DTCO and Computational Patterning II, 124951K (28 April 2023); https://doi.org/10.1117/12.2656456

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