Spin speed impact on photoresist thin film properties and EUV lithographic performance

Yinjie Cen; ChoongBong Lee; Li Cui; Suzanne M. Coley; Jong Keun Park; Benjamin D. Naab-Rafael; Emad Aqad; Rochelle Rena; Tyler Paul; Tom Penniman; Jason Behnke; Julia T. Early; Benjamin Foltz

doi:10.1117/12.2659101

30 April 2023 Spin speed impact on photoresist thin film properties and EUV lithographic performance

Yinjie Cen, ChoongBong Lee, Li Cui, Suzanne M. Coley, Jong Keun Park, Benjamin D. Naab-Rafael, Emad Aqad, Rochelle Rena, Tyler Paul, Tom Penniman, Jason Behnke, Julia T. Early, Benjamin Foltz

Author Affiliations +

Proceedings Volume 12498, Advances in Patterning Materials and Processes XL; 124981W (2023) https://doi.org/10.1117/12.2659101
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Conference Poster

Abstract

Chemically amplified resist (CAR) materials are widely used in advanced node patterning by extreme ultraviolet lithography (EUVL). To support the continuous requirement of reducing critical dimension (CD), CAR has been designed to process at tens of nanometer coating thickness while taking into consideration film roughness, aspect ratio, and etch transfer challenge. In this study, we investigated the impact of the photoresist’s different spin speed for same film thickness on resolution, line width roughness, and sensitivity (RLS) trade-off for Line and Space (L/S) patterns. We selected photoresists with identical chemical composition that differed only in total wt solid% in the solution. Photoresist films at constant thickness were investigated for the spin speed impacts on photoresist film density, hydrophobicity on the film surface, and film surface roughness. The corresponding EUV lithographic performance will be presented.

Citation Download Citation

Yinjie Cen, ChoongBong Lee, Li Cui, Suzanne M. Coley, Jong Keun Park, Benjamin D. Naab-Rafael, Emad Aqad, Rochelle Rena, Tyler Paul, Tom Penniman, Jason Behnke, Julia T. Early, and Benjamin Foltz "Spin speed impact on photoresist thin film properties and EUV lithographic performance", Proc. SPIE 12498, Advances in Patterning Materials and Processes XL, 124981W (30 April 2023); https://doi.org/10.1117/12.2659101

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available