Paper
11 October 2023 Interleaving-mapping: a novel data layout in scratchpad memory
Lingling Zeng, Dunbo Zhang, Li Shen, Qiang Dou
Author Affiliations +
Proceedings Volume 12800, Sixth International Conference on Computer Information Science and Application Technology (CISAT 2023); 128000C (2023) https://doi.org/10.1117/12.3004060
Event: 6th International Conference on Computer Information Science and Application Technology (CISAT 2023), 2023, Hangzhou, China
Abstract
Although linear address space is very simple, it forces a two-dimensional matrix to be stored using either row-major mode or column-major mode. These two modes lead to non-uniform memory access latencies because of their different data localities. A common solution to improve the efficiency of column-major accesses is matrix transposition. However, transposition not only introduces extra data transfer operations but also increases the memory space consumption which is used to hold the transposed matrix or columns. If the column-major accesses can be performed as efficient as the row-major accesses, the transposition will be unnecessary. This paper proposes an interleaving-mapping data layout. With this method, both the row-major and the column-major accesses can be implemented with customized read/write instructions. The interleaving-mapping data layout have been implemented in scratchpad memory. The experimental results show that interleaving-mapping scratchpad memory can provide 1.4x speedup on average with only 1.73% extra area overhead.
(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Lingling Zeng, Dunbo Zhang, Li Shen, and Qiang Dou "Interleaving-mapping: a novel data layout in scratchpad memory", Proc. SPIE 12800, Sixth International Conference on Computer Information Science and Application Technology (CISAT 2023), 128000C (11 October 2023); https://doi.org/10.1117/12.3004060
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KEYWORDS
Matrices

Scanning probe microscopy

Data modeling

Multiplexers

Design and modelling

Energy efficiency

Data storage

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