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13 March 2024 Packaging technologies of integrated photonics
Stefan Heinemann
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Proceedings Volume 12867, High-Power Diode Laser Technology XXII; 1286716 (2024) https://doi.org/10.1117/12.3007483
Event: SPIE LASE, 2024, San Francisco, California, United States
Abstract
Photonic quantum technology is based on photonic packages that combine active semiconductors generating single frequency radiation and photodetectors with Photonic Integrated Circuits (PIC) for routing the photons and active components for modulating the photons. Typically, tens of individual single mode channels must be precisely controlled for constant optical path length and sensitive, high frequency feedback loops are deployed. Integrated photonic packages must be designed for properly managing the temperature distribution between passive and active optical elements as well as proper heat dissipation. The routing of electrical DC and RF drive current as well as sensitive RF sense currents must be laid out for minimal interference. Consistent high optical coupling efficiency and very low losses of all optical channels is vital for performance.
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Stefan Heinemann "Packaging technologies of integrated photonics", Proc. SPIE 12867, High-Power Diode Laser Technology XXII, 1286716 (13 March 2024); https://doi.org/10.1117/12.3007483
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KEYWORDS
Quantum technologies
Integrated photonics
Packaging
Photonic integrated circuits
Channel projecting optics
Integrated optics
Photons
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