Analysis and research on failure of substrate for microwave module

Jia Li; Liuxi Duan; Shouli Jiang

doi:10.1117/12.3015370

6 February 2024 Analysis and research on failure of substrate for microwave module

Jia Li, Liuxi Duan, Shouli Jiang

Proceedings Volume 12979, Ninth International Conference on Energy Materials and Electrical Engineering (ICEMEE 2023); 129791N (2024) https://doi.org/10.1117/12.3015370
Event: 9th International Conference on Energy Materials and Electrical Engineering (ICEMEE 2023), 2023, Guilin, China

Abstract

LTCC is a typical brittle material with low tensile strength, which is easy to crack or even break under stress. In this paper, with a microwave module taken as an example, the failure analysis of the cracking phenomenon in the LTCC assembly process is carried out in principle and verified by the comparison simulation method. Finally, according to the analysis results, corresponding improvement measures are proposed to reduce the risk of substrate cracking.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Jia Li, Liuxi Duan, and Shouli Jiang "Analysis and research on failure of substrate for microwave module", Proc. SPIE 12979, Ninth International Conference on Energy Materials and Electrical Engineering (ICEMEE 2023), 129791N (6 February 2024); https://doi.org/10.1117/12.3015370

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