Numerical simulation study on stress field distribution of die-cutting machine under no-load condition

Yunfei Zhou; Cheng Wang; Bin Cheng; Hongguang Yang

doi:10.1117/12.3025680

28 February 2024 Numerical simulation study on stress field distribution of die-cutting machine under no-load condition

Yunfei Zhou, Cheng Wang, Bin Cheng, Hongguang Yang

Proceedings Volume 13071, International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023); 130712U (2024) https://doi.org/10.1117/12.3025680
Event: International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023), 2023, Shenyang, China

Abstract

This article mainly studies the stress field distribution of the die-cutting machine under no-load conditions, and uses numerical simulation methods to couple and mesh the main body of the die-cutting machine. By setting boundary and initial conditions, and applying working load on the transmission shaft, the stress field distribution of the main part of the die-cutting machine was numerically simulated using COMSOL software. The results show that the stress in the main body of the die-cutting machine is mainly concentrated on key components such as the transmission shaft, bearings, and gears, and is far below the yield strength of the material. In addition, the four upper swing rods of the die-cutting machine bear significant stress under no-load conditions. By studying the stress field distribution of die-cutting machines, strong support can be provided for the optimization design and fault diagnosis of die-cutting machines, ensuring their safe operation and efficient production.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Yunfei Zhou, Cheng Wang, Bin Cheng, and Hongguang Yang "Numerical simulation study on stress field distribution of die-cutting machine under no-load condition", Proc. SPIE 13071, International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023), 130712U (28 February 2024); https://doi.org/10.1117/12.3025680

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