Investigation of the stress distribution in intact bonds by holographic interferometry and finite element method

Thomas Bischof; Werner P. O. Jueptner

doi:10.1117/12.135318

1 January 1992 Investigation of the stress distribution in intact bonds by holographic interferometry and finite element method

Thomas Bischof, Werner P. O. Jueptner

Author Affiliations +

Proceedings Volume 1553, Laser Interferometry IV: Computer-Aided Interferometry; (1992) https://doi.org/10.1117/12.135318
Event: San Diego, '91, 1991, San Diego, CA, United States

Abstract

Adhesive bonding, especially the overlap adhesive bonded joint, is used in many applications, as in aircraft construction. For the development of new kinds of adhesives, there must be a testing technique which allows a fast and reliable detection of the stress distribution in the adhesive layer. In BIAS a method was developed which allows measurement of the entire specimen deformation. This deformation can be split into two parts: the adhesive layer and the two plate deformation. It has been shown by FEM calculation that in regions where the adhesive layer strain has its maximum, the entire specimen deformation is almost exclusively composed of the adhesive layer deformation. With this knowledge it is possible to determine the adhesive layer stress distribution by measuring the total deformation of the specimen.

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Thomas Bischof and Werner P. O. Jueptner "Investigation of the stress distribution in intact bonds by holographic interferometry and finite element method", Proc. SPIE 1553, Laser Interferometry IV: Computer-Aided Interferometry, (1 January 1992); https://doi.org/10.1117/12.135318

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