Paper
22 October 1993 New electronic shearing speckle pattern interferometer with continuously variable sensitivity
Nai-Keng Bao, G. C. Jin, Po Sheun Chung
Author Affiliations +
Proceedings Volume 2066, Industrial Optical Sensing and Metrology: Applications and Integration; (1993) https://doi.org/10.1117/12.162091
Event: Optical Tools for Manufacturing and Advanced Automation, 1993, Boston, MA, United States
Abstract
A new Electronic Shearing Speckle Pattern Interferometer (ESSPI) with continuously variable sensitivity is described. This new instrument not only provides variable sensitivity and improved shearing range but it also increases the maximum shearing sensitivity. It will be well suited to nondestructive testing applications in industry.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nai-Keng Bao, G. C. Jin, and Po Sheun Chung "New electronic shearing speckle pattern interferometer with continuously variable sensitivity", Proc. SPIE 2066, Industrial Optical Sensing and Metrology: Applications and Integration, (22 October 1993); https://doi.org/10.1117/12.162091
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CITATIONS
Cited by 1 scholarly publication.
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KEYWORDS
Nondestructive evaluation

Fringe analysis

Prisms

Interferometers

Speckle pattern

Image processing

Lenses

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