Characterization of the development of DNO/novolac resists by surface energy measurements

Emilienne Fadda; Gilles R. Amblard; Andre P. Weill; Alain Prola

doi:10.1117/12.175371

16 May 1994 Characterization of the development of DNQ/novolac resists by surface energy measurements

Emilienne Fadda, Gilles R. Amblard, Andre P. Weill, Alain Prola

Proceedings Volume 2195, Advances in Resist Technology and Processing XI; (1994) https://doi.org/10.1117/12.175371
Event: SPIE's 1994 Symposium on Microlithography, 1994, San Jose, CA, United States

Abstract

The resist processes used for optical lithography are mainly positive tone, based on the use of DNQ/novolac photoresists. It has been demonstrated that enhancing the resist pattern profiles is possible by optimization of the development step. Development techniques, such as two-step or interrupted development, have been introduced to enhance the contrast of DNQ/novolac resists. This paper demonstrates that the resist surface modifications occurring during development can be followed by surface energy measurements. The surface energy changes of four commercial resists (JSR IX 500, Shipley SPRT 510, OCG HPR 504 and Hoechst AZ 5206) during development are investigated. The results are then correlated to the changes in pattern profiles obtained when using the interrupted development technique.

Citation Download Citation

Emilienne Fadda, Gilles R. Amblard, Andre P. Weill, and Alain Prola "Characterization of the development of DNQ/novolac resists by surface energy measurements", Proc. SPIE 2195, Advances in Resist Technology and Processing XI, (16 May 1994); https://doi.org/10.1117/12.175371

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