Paper
26 October 1994 Anomalous damage behavior of BF2+ implantation in silicon
Chenglu Lin, Zu Yao Zhou, Xiao Qin Li, Shichang Zou, Peter L. F. Hemment
Author Affiliations +
Proceedings Volume 2364, Second International Conference on Thin Film Physics and Applications; (1994) https://doi.org/10.1117/12.190740
Event: Thin Film Physics and Applications: Second International Conference, 1994, Shanghai, China
Abstract
The anomalous damage behavior of BF2+ implantation into silicon at 300 K and 77 K has been investigated by using grazing angle Rutherford backscattering and channeling in combined with transmission electron microscopy. The damage or the amorphous layer produced by BF2+ implantation is different from other heavier ions (> 27Al+). For BF2+ implantation at 300 K, there are two damage peaks, one at a depth near the projectile range of the ions, the other at the near surface. While for BF2+ implantation at 77 K, the damage or the amorphous layer first occurs at the surface, then the amorphous layer is extended to the bulk of silicon with increasing does.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chenglu Lin, Zu Yao Zhou, Xiao Qin Li, Shichang Zou, and Peter L. F. Hemment "Anomalous damage behavior of BF2+ implantation in silicon", Proc. SPIE 2364, Second International Conference on Thin Film Physics and Applications, (26 October 1994); https://doi.org/10.1117/12.190740
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KEYWORDS
Silicon

Ions

Transmission electron microscopy

Scattering

Photomicroscopy

Backscatter

Transparency

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