Process and machine mastering employing WF-710 wafer inspection system

Jurgen Schwart; Rivi Sherman

doi:10.1117/12.240140

21 May 1996 Process and machine mastering employing WF-710 wafer inspection system

Jurgen Schwart, Rivi Sherman

Proceedings Volume 2725, Metrology, Inspection, and Process Control for Microlithography X; (1996) https://doi.org/10.1117/12.240140
Event: SPIE's 1996 International Symposium on Microlithography, 1996, Santa Clara, CA, United States

Abstract

With the growing complexity of modern processes, yield improvement is becoming more and more critical and challenging. The new Siemens Fab in Dresden is aimed to manufacture 16, 64, and 256 Mbit DRAM products. The goal is to achieve 'zero defect' leading to perfect yield, from the very beginning on.

Citation Download Citation

Jurgen Schwart and Rivi Sherman "Process and machine mastering employing WF-710 wafer inspection system", Proc. SPIE 2725, Metrology, Inspection, and Process Control for Microlithography X, (21 May 1996); https://doi.org/10.1117/12.240140

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available