Statistical metrology: understanding spatial variation in semiconductor manufacturing

Duane S. Boning; James E. Chung

doi:10.1117/12.250817

12 September 1996 Statistical metrology: understanding spatial variation in semiconductor manufacturing

Duane S. Boning, James E. Chung

Proceedings Volume 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II; (1996) https://doi.org/10.1117/12.250817
Event: Microelectronic Manufacturing 1996, 1996, Austin, TX, United States

Abstract

Variation is playing an increasingly important role in microelectronics manufacturing; variation not only impacts yield but also limits performance and reliability. Statistical metrology is an emerging body of methods for the systematic characterization and study of variation in semiconductor manufacturing. This paper considers the key elements of statistical metrology and reviews current progress in these areas, including (1) measurement methods and data gathering, (2) variation modeling and data analysis, and (3) study of the impact of variation. Potential applications of the methodology are widespread, with significant existing work in equipment characterization, layout optimization, and circuit impact analysis. Statistical metrology is an exciting new area of research that will play a critical role in future design and manufacture practice.

Citation Download Citation

Duane S. Boning and James E. Chung "Statistical metrology: understanding spatial variation in semiconductor manufacturing", Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); https://doi.org/10.1117/12.250817

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