Modified low-temperture direct bonding method for vacuum microelectronics application

Byeong-Kwon Ju; Duck-Jung Lee; Woo-Beom Choi; Yun-Hi Lee; Jin Jang; Kwang-Bae Lee; Myung-Hwan Oh

doi:10.1117/12.276625

19 June 1997 Modified low-temperture direct bonding method for vacuum microelectronics application

Byeong-Kwon Ju, Duck-Jung Lee, Woo-Beom Choi, Yun-Hi Lee, Jin Jang, Kwang-Bae Lee, Myung-Hwan Oh

Proceedings Volume 3046, Smart Structures and Materials 1997: Smart Electronics and MEMS; (1997) https://doi.org/10.1117/12.276625
Event: Smart Structures and Materials '97, 1997, San Diego, CA, United States

Abstract

This paper presents the process and experimental results for the improved silicon-to-glass bonding using silicon direct bonding (SDB) followed by anodic bonding. The initial bonding between glass and silicon was caused by the hydrophilic surfaces of silicon-glass ensemble using SDB method. Then the initially bonded specimen had to be strongly bonded by anodic bonding process. The effects of the bonding process parameters on the interface energy were investigated as functions of the bonding temperature and voltage. We found that the specimen which was bonded using SDB process followed by anodic bonding process had higher interface energy than one using anodic bonding process only. The main factor contributing to the higher interface energy in the glass-to-silicon assemble bonded by SDB followed by anodic bonding was investigated by secondary ion mass spectroscopy analysis.

Citation Download Citation

Byeong-Kwon Ju, Duck-Jung Lee, Woo-Beom Choi, Yun-Hi Lee, Jin Jang, Kwang-Bae Lee, and Myung-Hwan Oh "Modified low-temperture direct bonding method for vacuum microelectronics application", Proc. SPIE 3046, Smart Structures and Materials 1997: Smart Electronics and MEMS, (19 June 1997); https://doi.org/10.1117/12.276625

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
7 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Semiconducting wafers

Glasses

Interfaces

Silicon

Wafer bonding

Ions

Sodium

Show All Keywords

Keywords/Phrases

Search In:

Publication Years