Deep anisotropic ICP plasma etching designed for high-volume MEMS manufacturing

Keven Yu; Michael Feldbaum; Tam Pandhumsoporn; Prashant Gadgil

doi:10.1117/12.361224

30 August 1999 Deep anisotropic ICP plasma etching designed for high-volume MEMS manufacturing

Keven Yu, Michael Feldbaum, Tam Pandhumsoporn, Prashant Gadgil

Proceedings Volume 3874, Micromachining and Microfabrication Process Technology V; (1999) https://doi.org/10.1117/12.361224
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States

Abstract

ICP plasma etching is gaining widespread acceptance as an enabling micromachining technology for advanced MEMS fabrication. Whereas this technology has shown a capability of delivering multiple novel applications for R and D, its acceptance by industry for high volume production has been limited. This acceptance into production will only occur when the plasma etching equipment with this technology offers the device performance, throughput, reliability, and uptime criteria required by a production facility. The design of the plasma etcher using this technology and the process capability it consequently delivers, has significant implications in making this a reality. Alcatel has been supplying such a technology to this MEMS industry for over 5 years and in the interim has evolved its product and process to make this technology production worthy. Alcatel's next generation etcher, the Alcatel 601E, offers multiple advantages to MEMS manufacturers in realizing their production goals.

Citation Download Citation

Keven Yu, Michael Feldbaum, Tam Pandhumsoporn, and Prashant Gadgil "Deep anisotropic ICP plasma etching designed for high-volume MEMS manufacturing", Proc. SPIE 3874, Micromachining and Microfabrication Process Technology V, (30 August 1999); https://doi.org/10.1117/12.361224

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