Paper
30 August 1999 Multidimensional calculation of coupled flow and electrodeposition in microscopic trenches
Chunmei Xia, Jayathi Y. Murthy, Minking K. Chyu, Yao Cheng
Author Affiliations +
Proceedings Volume 3874, Micromachining and Microfabrication Process Technology V; (1999) https://doi.org/10.1117/12.361242
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
Numerical simulations have been done to delineate transport effects on the electrodeposition of heavy ions in the deep cavities typically fabricated by the LIGA process. Both forced convection and buoyancy-driven natural convection have been considered. Flow patterns and deposition rates have been calculated for a range of electrode reaction rates, forced flow Reynolds numbers, Rayleigh numbers and cavity aspect ratios. The results show that free convection is a significant player in the transport-limited regime, and substantially increases deposition rates, even for modest Rayleigh numbers. For high Rayleigh numbers, the flows are found to be unsteady, and may further increase deposition rates.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chunmei Xia, Jayathi Y. Murthy, Minking K. Chyu, and Yao Cheng "Multidimensional calculation of coupled flow and electrodeposition in microscopic trenches", Proc. SPIE 3874, Micromachining and Microfabrication Process Technology V, (30 August 1999); https://doi.org/10.1117/12.361242
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KEYWORDS
Electrodes

Convection

Ions

Diffusion

Radium

Metals

Electroplating

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