Material-related effects on wet chemical micromachining of smart MEMS devices

Aylin Hein; Stefan Finkbeiner; Jiri Marek; Ernst Obermeier

doi:10.1117/12.360492

31 August 1999 Material-related effects on wet chemical micromachining of smart MEMS devices

Aylin Hein, Stefan Finkbeiner, Jiri Marek, Ernst Obermeier

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Proceedings Volume 3876, Micromachined Devices and Components V; (1999) https://doi.org/10.1117/12.360492
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States

Abstract

Smart MEMS devices such as pressure, mass flow and yaw rate sensors are presented in detail. One common point of this range of devices is their fabrication technology regarding anisotropic etching. This paper is first meant to give a short review upon the applications processed by using wet chemical etching in KOH-solutions. Furthermore, we will discuss about the impact of material and process related defects in the silicon crystal and on the anisotropic etching behavior.

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Aylin Hein, Stefan Finkbeiner, Jiri Marek, and Ernst Obermeier "Material-related effects on wet chemical micromachining of smart MEMS devices", Proc. SPIE 3876, Micromachined Devices and Components V, (31 August 1999); https://doi.org/10.1117/12.360492

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