Paper
2 June 2000 Utilizing in-line CD SEMs for intensive field mapping
Margaret S. Fyfield, George E. Bailey, Waiman Ng, Mohsen Ahmadian
Author Affiliations +
Abstract
With the large field sizes scanners offer today, lens mapping (dense across-the-field CD measurements to quantify illumination and coherency aberrations) requires an extensive number of line width measurements to be taken for accurate lens evaluation. There are concerns that the accuracy required for field mapping may not be possible with a Top-Down SEM, pushing the industry to move to electrical CD (ECD) measurement. However, the etch process required for ECD can induce systematic error, either from the iso-dense etch bias or from the equipment itself. This paper explores the capability of utilizing an in-line CD SEM for extensive CD measurement collection and the requirements to achieve statistically valid data for lens mapping.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Margaret S. Fyfield, George E. Bailey, Waiman Ng, and Mohsen Ahmadian "Utilizing in-line CD SEMs for intensive field mapping", Proc. SPIE 3998, Metrology, Inspection, and Process Control for Microlithography XIV, (2 June 2000); https://doi.org/10.1117/12.386522
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KEYWORDS
Critical dimension metrology

Reticles

Semiconducting wafers

Scanning electron microscopy

Error analysis

Scanners

Metrology

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