Paper
10 April 2000 Dynamic checking improves MEMS design methodology
Xavi Marin, Jordi Carrabina, Joan Bausells
Author Affiliations +
Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000) https://doi.org/10.1117/12.382310
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France
Abstract
Design verification methodologies and tool such as DRC and ERC used on MEMS design have been inherited from the transistor based analog and digital full custom design flows. However the devices are defined on a 2D layout, they have a 3D structure. Thus, current tools do not have into account the new features that appear in MEMS design, especially those related with device micro machining. The main consequence on it is that it is necessary to include information of the vertical parameters on the DRC, what is not at all usual in classical design. We claim that the inclusion of such information together with the consequent improvement of tools for DRC, ERC and device parameter extraction, can reduce design and simulation efforts as well as improve the manufacturing yield.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xavi Marin, Jordi Carrabina, and Joan Bausells "Dynamic checking improves MEMS design methodology", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); https://doi.org/10.1117/12.382310
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KEYWORDS
Etching

Microelectromechanical systems

Manufacturing

Tolerancing

Semiconducting wafers

Finite element methods

Standards development

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