Insertion of EUVL into high-volume manufacturing

Peter J. Silverman

doi:10.1117/12.436631

20 August 2001 Insertion of EUVL into high-volume manufacturing

Peter J. Silverman

Proceedings Volume 4343, Emerging Lithographic Technologies V; (2001) https://doi.org/10.1117/12.436631
Event: 26th Annual International Symposium on Microlithography, 2001, Santa Clara, CA, United States

Abstract

EUV Lithography has become the leading and perhaps only, candidate for extension of semiconductor lithography into the sub-50nm realm. This paper reviews the requirements for high volume, semiconductor lithography and examines the capability of EUVL to meet those challenges. The current state of EUVL technology is reviewed and the remaining challenges for insertion of EUVL into manufacturing are discussed.

Citation Download Citation

Peter J. Silverman "Insertion of EUVL into high-volume manufacturing", Proc. SPIE 4343, Emerging Lithographic Technologies V, (20 August 2001); https://doi.org/10.1117/12.436631

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