Paper
28 September 2001 Micromachined thermal actuated microlegs for an insectlike microrobot
Agnes Bonvilain, Jean-Rene Coudevylle, Pascal Blind, Nicolas Chaillet
Author Affiliations +
Proceedings Volume 4557, Micromachining and Microfabrication Process Technology VII; (2001) https://doi.org/10.1117/12.442972
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States
Abstract
This paper deals with a work in progress concerning the fabrication of an insect-like microrobot. Thermal actuation has been chosen to move this microrobot, because of their large motions and their interesting density of energy. An integrated structure was chosen. Compliant thermal micro- actuators have been studied, fabricated and experimented. The characterization and modeling of these actuators have been done. Then, microlegs were modelized and designed with two degrees of freedom for each leg. The design of the microlegs and the operating cycle are given in this paper. Then the various stages of the microfabrication process are precisely described the microlegs are constituted of two thermal bimorphs connected together with a microbeam. Several microlegs are fabricated on one silicone wafer and bonded on a printed board to allow their activation. Their experimentation allows to give the results of each of the two degrees of freedom concerning the motions of these microlegs. Based on the results of these first experiments, the second generation of microlegs was conceived, made and tested, with the aim of decreasing the energy consumption. Then the next step will be the microfabrication of a new type of microlegs, before the whole structure of the microrobot including their legs in a monolithic way on one single silicon wafer.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Agnes Bonvilain, Jean-Rene Coudevylle, Pascal Blind, and Nicolas Chaillet "Micromachined thermal actuated microlegs for an insectlike microrobot", Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); https://doi.org/10.1117/12.442972
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Cited by 3 scholarly publications.
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KEYWORDS
Silicon

Nickel

Actuators

Copper

Electroplating

Sputter deposition

Semiconducting wafers

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