New test structure for measuring thermal conductivity of polysilicon thin films

Gaobin Xu; Qing-An Huang; Yanfeng Jiang

doi:10.1117/12.483184

10 September 2002 New test structure for measuring thermal conductivity of polysilicon thin films

Gaobin Xu, Qing-An Huang, Yanfeng Jiang

Proceedings Volume 4928, MEMS/MOEMS Technologies and Applications; (2002) https://doi.org/10.1117/12.483184
Event: Photonics Asia, 2002, Shanghai, China

Abstract

This paper introduces a new test structure for thermal conductivity of poly-silicon thin films, and analyzes the feature ofthe measurement structure, modeling and measurement methods. The structure was fabricated by using surface micromachining process for vacuum encapsulation fabrication, while post- processing bulk silicon micromachining is not essential.

Citation Download Citation

Gaobin Xu, Qing-An Huang, and Yanfeng Jiang "New test structure for measuring thermal conductivity of polysilicon thin films", Proc. SPIE 4928, MEMS/MOEMS Technologies and Applications, (10 September 2002); https://doi.org/10.1117/12.483184

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