Paper
2 June 2003 Application of simulation-based defect printability analysis at mask qualification control
Jerry Lu, Alex Lu, Linyong Pang, Don Lee, Jiunn-Hung Chen
Author Affiliations +
Abstract
As the semiconductor industry continues to scale down critical dimensions (CD), proximity effects get more and more severe. As such, aggressive Optical Proximity Correction (OPC) features like hammerheads, serifs and assist bars inevitably appear on fabricated masks. The great challenge, however -- to reliably assure the quality of these advanced masks -- is to be able to direclty judge a controversial defect under such complex features. It is necessary to find a more effective way to accurately disposition the defects found on these masks. Simulation-based defect disposition strategies have now become much more important for judging defect printabiilty. In this paper, we use variaous simulation tools to make a systematic study of defect printability right from the design to wafer printing. Four different combinations of OPC features with assist bars are presented here to demonstrate the defect printability and their induced CD changes compared to wafer results.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jerry Lu, Alex Lu, Linyong Pang, Don Lee, and Jiunn-Hung Chen "Application of simulation-based defect printability analysis at mask qualification control", Proc. SPIE 5038, Metrology, Inspection, and Process Control for Microlithography XVII, (2 June 2003); https://doi.org/10.1117/12.485010
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Cited by 1 scholarly publication and 1 patent.
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KEYWORDS
Optical proximity correction

Photomasks

Semiconducting wafers

Critical dimension metrology

Inspection

Printing

Reticles

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