Technology CAD for integrated circuit fabrication technology development and technology transfer

Samar Saha

doi:10.1117/12.485267

10 July 2003 Technology CAD for integrated circuit fabrication technology development and technology transfer

Samar Saha

Proceedings Volume 5042, Design and Process Integration for Microelectronic Manufacturing; (2003) https://doi.org/10.1117/12.485267
Event: Advanced Microelectronic Manufacturing, 2003, Santa Clara, CA, United States

Abstract

In this paper systematic simulation-based methodologies for integrated circuit (IC) manufacturing technology development and technology transfer are presented. In technology development, technology computer-aided design (TCAD) tools are used to optimize the device and process parameters to develop a new generation of IC manufacturing technology by reverse engineering from the target product specifications. While in technology transfer to manufacturing co-location, TCAD is used for process centering with respect to high-volume manufacturing equipment of the target manufacturing equipment of the target manufacturing facility. A quantitative model is developed to demonstrate the potential benefits of the simulation-based methodology in reducing the cycle time and cost of typical technology development and technology transfer projects over the traditional practices. The strategy for predictive simulation to improve the effectiveness of a TCAD-based project, is also discussed.

Citation Download Citation

Samar Saha "Technology CAD for integrated circuit fabrication technology development and technology transfer", Proc. SPIE 5042, Design and Process Integration for Microelectronic Manufacturing, (10 July 2003); https://doi.org/10.1117/12.485267

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