Paper
2 April 2004 Mass-production fabrication of miniaturized plastic chip devices for biochemical applications
Tsuyoshi Fujimura, Shinichi Etoh, Akihiro Ikeda, Reiji Hattori, Yukinori Kuroki
Author Affiliations +
Abstract
A very important aspect in the next stage of genomic research will be the study of genetic diversity originating from an individual, for example, a single nucleotide polymorphism (SNP),. For this, the base-pair sequence needs to be determined quickly and easily; along with effectively gathering the proteins that are produced from the cell and depend on each genetic design. To meet these demands, the use of a miniaturized experimental apparatus formed on a chip is suitable as it gives a very small and well-controlled space to undertake precise analyses. This type of chip device needs to be disposable, inexpensive and of uniform quality, therefore many chips should be fabricated at the same time from a low cost chip material such as plastic. A mass production fabrication process for such plastic chips was determined as follows. A thick coating type photoresist was spin-coated onto a 4-inch size Si wafer to 20 μm thickness and patterned by UV-lithography. Thick Au structures were embedded into the resist mold by microelectropolating. After removal of the resist, Au fine structures remained and were used as a metal mold for plastic casting. Plastic, polymethylmethacrylate (PMMA), beads were dissolved in acetone and the polymer solution was cast into the metal mold under vacuum heating environment producing many identical plastic chips at a thickness of 1 mm. The size of the chemical reaction channel, one of the device’s components, was 50 μm in width and 20 μm in depth.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tsuyoshi Fujimura, Shinichi Etoh, Akihiro Ikeda, Reiji Hattori, and Yukinori Kuroki "Mass-production fabrication of miniaturized plastic chip devices for biochemical applications", Proc. SPIE 5276, Device and Process Technologies for MEMS, Microelectronics, and Photonics III, (2 April 2004); https://doi.org/10.1117/12.522747
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KEYWORDS
Polymethylmethacrylate

Gold

Metals

Plating

Electroplating

Polymers

Silicon

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