Effect of PEB exhaust on resist CD for DUV process

Shu-Fen Tsai; Yuh-Shyang Chiu; Chih-Horng Chien; Hann-Yii Gao; Chin-Yu Ku

doi:10.1117/12.534486

14 May 2004 Effect of PEB exhaust on resist CD for DUV process

Shu-Fen Tsai, Yuh-Shyang Chiu, Chih-Horng Chien, Hann-Yii Gao, Chin-Yu Ku

Proceedings Volume 5376, Advances in Resist Technology and Processing XXI; (2004) https://doi.org/10.1117/12.534486
Event: Microlithography 2004, 2004, Santa Clara, California, United States

Abstract

In this work, the effect of exhaust condition during Post Exposure Bake (PEB) on the critical dimension (CD) performance has been investigated for different DUV resists. Two kinds of PEB chamber cover designs have been tested to see the influence of exhaust flow on CD. It has been found that cleaning and adjusting of PEB exhaust flow will change the resist CD. To confirm the impact of PEB exhaust condition on production, resists for both lines and contact holes are verified by scanning electron microscope (SEM).

Citation Download Citation

Shu-Fen Tsai, Yuh-Shyang Chiu, Chih-Horng Chien, Hann-Yii Gao, and Chin-Yu Ku "Effect of PEB exhaust on resist CD for DUV process", Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); https://doi.org/10.1117/12.534486

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