0.13/0.15-µm production reticle process window qualification procedure for 200mm manufacturing fab

Zih-Wen Chang; Chen-Ming Wu; Mabel Mo; Chin-Chung Shieh; D.S. Cheng; Chun-Chien Chen; Richard Y. Yang; David W. Randall; Wen-Cheng Yu

doi:10.1117/12.557698

20 August 2004 0.13-/0.15-μm production reticle process window qualification procedure for 200-mm manufacturing fab

Zih-Wen Chang, Chen-Ming Wu, Mabel Mo, Chin-Chung Shieh, D.S. Cheng, Chun-Chien Chen, Richard Y. Yang, David W. Randall, Wen-Cheng Yu

Author Affiliations +

Proceedings Volume 5446, Photomask and Next-Generation Lithography Mask Technology XI; (2004) https://doi.org/10.1117/12.557698
Event: Photomask and Next Generation Lithography Mask Technology XI, 2004, Yokohama, Japan

Abstract

The increasing complexity of Resolution Enhancements Techniques (RET) in optical lithography requires careful qualification of new reticle designs when they arrive at the wafer fab before commiting them to printing product. In order to qualify the reticle designs at the wafer level, process window qualification (PWQ) is performed by inspecting wafers printed with the reticles to be qualified. The output from the wafer inspection tool provides information on the regions of marginality within the reticle field or features within the die which can have a smaller than expected process window. tsmc Fab 6, an advanced high volume production foundry fab, uses an effective and efficient standardized PWQ procedure to qualify new incoming reticle designs described herein.

Citation Download Citation

Zih-Wen Chang, Chen-Ming Wu, Mabel Mo, Chin-Chung Shieh, D.S. Cheng, Chun-Chien Chen, Richard Y. Yang, David W. Randall, and Wen-Cheng Yu "0.13-/0.15-μm production reticle process window qualification procedure for 200-mm manufacturing fab", Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); https://doi.org/10.1117/12.557698

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