Paper
28 June 2005 Aerial image based mask defect detection in dense array structures
Author Affiliations +
Abstract
For leading mask technologies the mask inspection for finding critical defects is always a difficult task. With the introduction of chrome-less, high-transmission and alternating mask types, new absorber material and the possibility of quartz defects the defect inspection and -classification becomes even more challenging. To decide whether a defect is critical or a repair is successful, the Zeiss AIMS tool is used to classify defects. For conventional imaging the optical settings are usually chosen such that resolution is maximized, for example a dipole illumination is used for imaging a dense line-space array at an optimum contrast. In this paper we will do the opposite and reduce the optical resolution, such that we can filter out the array pattern and study the resulting defect image. This technique allows using a simple threshold detector to find and classify defects.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Roderick Kohle, Mario Hennig, Rainer Pforr, Karsten Bubke, Martin Sczyrba, and Arndt C. Durr "Aerial image based mask defect detection in dense array structures", Proc. SPIE 5853, Photomask and Next-Generation Lithography Mask Technology XII, (28 June 2005); https://doi.org/10.1117/12.617303
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Photomasks

Printing

Semiconducting wafers

Inspection

Defect detection

Imaging arrays

Diffraction

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