Solderability of melting lead-free solder to tiny joint of electronic products

Fang Chen; Changhua Du; Yunfei Du

doi:10.1117/12.664270

21 March 2006 Solderability of melting lead-free solder to tiny joint of electronic products

Fang Chen, Changhua Du, Yunfei Du

Proceedings Volume 6040, ICMIT 2005: Mechatronics, MEMS, and Smart Materials; 60402K (2006) https://doi.org/10.1117/12.664270
Event: ICMIT 2005: Merchatronics, MEMS, and Smart Materials, 2005, Chongqing, China

Abstract

The behavior of melting solder has an important influence on the tiny joints of electronic products. In order to improve the properties of lead-free solder, a Sn-3.5Ag0.6Cu alloy was smelted using traditional and a modified technology, respectively. The solderability of the two alloys were investigated using a wetting balance method for the different conditions. The test results showed that the modified solder had good solderability, where the excellent flux used was rosin-ethanol or rosin-isopropanol solution. In experimental condition, when the added active agent is 0.4% of rosin mass or 0.1% of solution mass, the wetting velocity and wetting force can be improved 5 times and 1.5 times, respectively. The best soldering parameters are temperature levels less than or equal to 270°, and the soakage time in 2-3s.

Citation Download Citation

Fang Chen, Changhua Du, and Yunfei Du "Solderability of melting lead-free solder to tiny joint of electronic products", Proc. SPIE 6040, ICMIT 2005: Mechatronics, MEMS, and Smart Materials, 60402K (21 March 2006); https://doi.org/10.1117/12.664270

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