A new device for characterization of mechanical stress caused by packaging processes

Soeren Hirsch; Bertram Schmidt

doi:10.1117/12.659423

31 March 2006 A new device for characterization of mechanical stress caused by packaging processes

Soeren Hirsch, Bertram Schmidt

Proceedings Volume 6172, Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology; 617210 (2006) https://doi.org/10.1117/12.659423
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2006, San Diego, California, United States

Abstract

This paper reports on a new method for estimation and minimization of mechanical stress on MEMS sensor and actuator structures due to packaging processes based on flip chip technology. For studying mechanical stress a test chip with silicon diaphragms was fabricated. A network of piezo-resistive solid state resistors created by diffusion was used to measure the surface tension pattern between adjacent diaphragms. Finite element method simulation was used to calculate the stress profile and to determine the optimum positions for placing the resistive network.

Citation Download Citation

Soeren Hirsch and Bertram Schmidt "A new device for characterization of mechanical stress caused by packaging processes", Proc. SPIE 6172, Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, 617210 (31 March 2006); https://doi.org/10.1117/12.659423

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