EUV lithography with the Alpha Demo Tools: status and challenges

Noreen Harned; Mieke Goethals; Rogier Groeneveld; Peter Kuerz; Martin Lowisch; Henk Meijer; Hans Meiling; Kurt Ronse; James Ryan; Michael Tittnich; Harm-Jan Voorma; John Zimmerman; Uwe Mickan; Sjoerd Lok

doi:10.1117/12.712065

13 March 2007 EUV lithography with the Alpha Demo Tools: status and challenges

Noreen Harned, Mieke Goethals, Rogier Groeneveld, Peter Kuerz, Martin Lowisch, Henk Meijer, Hans Meiling, Kurt Ronse, James Ryan, Michael Tittnich, Harm-Jan Voorma, John Zimmerman, Uwe Mickan, Sjoerd Lok

Author Affiliations +

Proceedings Volume 6517, Emerging Lithographic Technologies XI; 651706 (2007) https://doi.org/10.1117/12.712065
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States

Abstract

ASML has built and shipped to The College of Nanoscale Science and Engineering of the University at Albany (CNSE) and IMEC two full field step-and-scan exposure tools for extreme ultraviolet lithography. These tools, known as Alpha Demo Tools (ADT), will be used for process development and to set the foundation for the commercialization of this technology. In this paper we will present results from the set-up and integration of both ADT systems, status of resist and reticles for EUV, and the plans for using these tools at the two research centers. We will also present the first resist images from one of the tools at the customer site, and demonstrate 32nm half-pitch dense lines/spaces printing as well as 32nm dense contact hole printing.

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Noreen Harned, Mieke Goethals, Rogier Groeneveld, Peter Kuerz, Martin Lowisch, Henk Meijer, Hans Meiling, Kurt Ronse, James Ryan, Michael Tittnich, Harm-Jan Voorma, John Zimmerman, Uwe Mickan, and Sjoerd Lok "EUV lithography with the Alpha Demo Tools: status and challenges", Proc. SPIE 6517, Emerging Lithographic Technologies XI, 651706 (13 March 2007); https://doi.org/10.1117/12.712065

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