Novel method of under-etch defect detection for contact layers based on Si substrate using optic wafer inspection tools

Byoung-Ho Lee; Jin-Seo Choi; Soo-Bok Chin; Do-Hyun Cho; Chang-Lyong Song

doi:10.1117/12.710746

5 April 2007 Novel method of under-etch defect detection for contact layers based on Si substrate using optic wafer inspection tools

Byoung-Ho Lee, Jin-Seo Choi, Soo-Bok Chin, Do-Hyun Cho, Chang-Lyong Song

Author Affiliations +

Proceedings Volume 6518, Metrology, Inspection, and Process Control for Microlithography XXI; 651847 (2007) https://doi.org/10.1117/12.710746
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States

Abstract

As the design rules of semiconductor devices have decreased, the detection of critical killer defect has became more important. One of killer defect is under-etch defect caused by insufficient contact etch. Although very low throughput only e-beam inspection tool has used for monitoring tools of under-etch defect because optic wafer inspection does not have enough defect signal to detect that on a contact layer. In this study, a new method is suggested for detection of under-etch defect using optic wafer inspection tools which have high throughput and repeatability.

Citation Download Citation

Byoung-Ho Lee, Jin-Seo Choi, Soo-Bok Chin, Do-Hyun Cho, and Chang-Lyong Song "Novel method of under-etch defect detection for contact layers based on Si substrate using optic wafer inspection tools", Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 651847 (5 April 2007); https://doi.org/10.1117/12.710746

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