Paper
27 March 2007 Golden curve method for OPC signature stability control in high MEEF applications
Katja Geidel, Torsten Franke, Stefan Roling, Peter Buck, Martin Sczyrba, Engelbert Mittermeier, Russell Cinque
Author Affiliations +
Abstract
The super-sensitivity of wafer critical dimensions (CDs) to mask CDs at low k1, known as the Mask Error Enhancement Factor (MEEF) drives the need for increasingly tighter mask CD control. In addition, the accuracy of the model based optical proximity correction (OPC) used to compensate systematic lithographic errors is partially dependent on a stable mask CD error signature that expands mask CD control requirements over multiple feature types. This paper presents the need for improved quantification and monitoring of mask CD signatures that includes CD characteristics relevant to OPC model calibration. It also introduces and discusses a new method to characterize, quantify, and control mask signatures in a mask manufacturing environment to limit the impact of mask CD variations on the OPC model validity. Multiple approaches to implementing this "golden curve" method are discussed in terms of their advantages and disadvantages.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Katja Geidel, Torsten Franke, Stefan Roling, Peter Buck, Martin Sczyrba, Engelbert Mittermeier, and Russell Cinque "Golden curve method for OPC signature stability control in high MEEF applications", Proc. SPIE 6520, Optical Microlithography XX, 652040 (27 March 2007); https://doi.org/10.1117/12.712867
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Cited by 1 scholarly publication.
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KEYWORDS
Photomasks

Optical proximity correction

Critical dimension metrology

Semiconducting wafers

Metrology

Lithography

Manufacturing

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