Paper
30 October 2007 Estimating DPL photomask fabrication load compared with single exposure
Author Affiliations +
Abstract
DPL (Double Patterning Lithography) has been identified as one of major candidates for 45nm and 32nm HP since ITRS2006update and several reports of the performance or challenges of DPL have been published. DPL requires at least two photomasks with tighter specification of image placement and the difference of mean to target according to ITRS2006update. On the other hand, approximately half of whole features of single layer are written on each photomask and the densest features are split into other photomask in consequence of pitch relaxation for DPL. Then the photomask writing data of two sets for DPL and single data for single exposure are evaluated for photomask fabrication load. The design will be automatically decomposed with EDA tool and OPC will be tuned as DPL or single exposure. Not only number of fractured features but also feasibility study of automatic decomposition will be presented and discussed. The consequences of relaxed pitch on process, inspection, repair, yield, MEEF and cycle time will be discussed with results as available.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nobuhito Toyama, Yuichi Inazuki, Takanori Sutou, Takaharu Nagai, Yasutaka Morikawa, Hiroshi Mohri, Naoya Hayashi, Judy A. Huckabay, and Yoshikuni Abe "Estimating DPL photomask fabrication load compared with single exposure", Proc. SPIE 6730, Photomask Technology 2007, 67301J (30 October 2007); https://doi.org/10.1117/12.746982
Lens.org Logo
CITATIONS
Cited by 2 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Photomasks

Optical proximity correction

Inspection

Design for manufacturing

Lithography

Double patterning technology

Electronic design automation

Back to Top