Paper
14 February 2008 Challenges of designing and processing extreme low-G microelectromechanical system (MEMS) accelerometers
Thomas P Swiler, Uma Krishnamoorthy, Peggy J. Clews, Michael S. Baker, Danelle M. Tanner
Author Affiliations +
Abstract
There is an increasing demand to build highly sensitive, low-G, microscale acceleration sensors with the ability to sense accelerations in the nano-G (10-8 m/s2) regime. To achieve such sensitivities, these sensors require compliant mechanical springs attached to large masses. The high sensitivities and the difficulty in integrating robust mechanical stops into these designs make these parts inherently weak, lacking the robustness to survive even the low level accelerations encountered in standard handling, from release processing, where supporting interlayers present during fabrication are etched away, through packaging. Thus, the process of transforming a MEMS-based acceleration sensor from an unreleased state to a protected functional state poses significant challenges. We summarize prior experiences with packaging such devices and report on recent work in packaging and protecting a highly sensitive acceleration sensor that optically senses displacement through the use of sub-wavelength nanogratings. We find that successful implementation of such sensors requires starting with a clean and robust MEMS design, performing careful and controlled release processing, and designing and executing a robust handling and packaging solution that keeps a fragile MEMS device protected at all times.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas P Swiler, Uma Krishnamoorthy, Peggy J. Clews, Michael S. Baker, and Danelle M. Tanner "Challenges of designing and processing extreme low-G microelectromechanical system (MEMS) accelerometers", Proc. SPIE 6884, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII, 68840O (14 February 2008); https://doi.org/10.1117/12.778244
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CITATIONS
Cited by 7 scholarly publications.
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KEYWORDS
Semiconducting wafers

Packaging

Sensors

Microelectromechanical systems

Silicon

Silica

Epoxies

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