30nm half-pitch metal patterning using Moti CD shrink technique and double patterning

Janko Versluijs; J.-F. De Marneffe; Danny Goossens; Maaike Op de Beeck; Tom Vandeweyer; Vincent Wiaux; Herbert Struyf; Mireille Maenhoudt; Mohand Brouri; Johan Vertommen; Ji Soo Kim; Helen Zhu; Reza Sadjadi

doi:10.1117/12.774139

1 April 2008 30nm half-pitch metal patterning using Moti CD shrink technique and double patterning

Janko Versluijs, J.-F. De Marneffe, Danny Goossens, Maaike Op de Beeck, Tom Vandeweyer, Vincent Wiaux, Herbert Struyf, Mireille Maenhoudt, Mohand Brouri, Johan Vertommen, Ji Soo Kim, Helen Zhu, Reza Sadjadi

Author Affiliations +

Proceedings Volume 6924, Optical Microlithography XXI; 69242C (2008) https://doi.org/10.1117/12.774139
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

Double patterning lithography appears a likely candidate to bridge the gap between water-based immersion lithography and EUV. A double patterning process is discussed for 30nm half-pitch interconnect structures, using 1.2 NA immersion lithography combined with the Motif^TM CD shrink technique. An adjusted OPC calculation is required to model the proximity effects of the Motif shrink technique and subsequent metal hard mask (MHM) etch, on top of the lithography based proximity effects. The litho-etch-litho-etch approach is selected to pattern a TiN metal hard mask. This mask is then used to etch the low-k dielectric. The various process steps and challenges encountered are discussed, with the feasibility of this approach demonstrated by successfully transferring a 30nm half-pitch pattern into the MHM.

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Janko Versluijs, J.-F. De Marneffe, Danny Goossens, Maaike Op de Beeck, Tom Vandeweyer, Vincent Wiaux, Herbert Struyf, Mireille Maenhoudt, Mohand Brouri, Johan Vertommen, Ji Soo Kim, Helen Zhu, and Reza Sadjadi "30nm half-pitch metal patterning using Moti CD shrink technique and double patterning", Proc. SPIE 6924, Optical Microlithography XXI, 69242C (1 April 2008); https://doi.org/10.1117/12.774139

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