Rigorous CMP and electroplating simulations for DFM applications

Yuri Granik; Norbert Strecker

doi:10.1117/12.771702

12 March 2008 Rigorous CMP and electroplating simulations for DFM applications

Yuri Granik, Norbert Strecker

Proceedings Volume 6925, Design for Manufacturability through Design-Process Integration II; 692507 (2008) https://doi.org/10.1117/12.771702
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

We present the chip-scale CMP simulator for layer uniformity analysis within Calibre DFM framework. The CMP simulator is intended to be used during smart fill optimizations, accurate parasitic extractions, defocus variability compensations, and other DFM applications. It is tightly integrated with Mentor Graphics DFM components for yield analysis and optimization. The paper discusses the key concepts of the electro-chemical copper deposition and slurry CMP models that are used in the simulation. The data flow is described, including the use of mask information from design layout data. Application examples, including the process flow and the simulated results, are presented. Both the electroplating and the CMP models include empirical parameters that describe the width- and space- dependency. Fast and accurate global optimization search algorithms are implemented to find optimum modeling parameter values.

Citation Download Citation

Yuri Granik and Norbert Strecker "Rigorous CMP and electroplating simulations for DFM applications", Proc. SPIE 6925, Design for Manufacturability through Design-Process Integration II, 692507 (12 March 2008); https://doi.org/10.1117/12.771702

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