Fabrication of large-scale monocrystalline silicon micro-mirror arrays using adhesive wafer transfer bonding

Fabian Zimmer; Frank Niklaus; Martin Lapisa; Thomas Ludewig; Martin Bring; Martin Friedrichs; Thor Bakke; Harald Schenk; Wouter van der Wijngaart

doi:10.1117/12.808694

18 February 2009 Fabrication of large-scale monocrystalline silicon micro-mirror arrays using adhesive wafer transfer bonding

Fabian Zimmer, Frank Niklaus, Martin Lapisa, Thomas Ludewig, Martin Bring, Martin Friedrichs, Thor Bakke, Harald Schenk, Wouter van der Wijngaart

Author Affiliations +

Proceedings Volume 7208, MOEMS and Miniaturized Systems VIII; 720807 (2009) https://doi.org/10.1117/12.808694
Event: SPIE MOEMS-MEMS: Micro- and Nanofabrication, 2009, San Jose, California, United States

Abstract

Today, spatial light modulators (SLMs) based on individually addressable micro-mirrors play an important role for use in DUV lithography and adaptive optics. Especially the mirror planarity and stability are important issues for these applications. Mono-crystalline silicon as mirror material offers a great possibility to combine the perfect surface with the good mechanical properties of the crystalline material. Nevertheless, the challenge is the integration of mono-crystalline silicon in a CMOS process with low temperature budget (below 450°C) and restricted material options. Thus, standard processes like epitaxial growth or re-crystallization of poly-silicon cannot be used. We will present a CMOS-compatible approach, using adhesive wafer transfer bonding with Benzocyclobutene (BCB) of a 300nm thin silicon membrane, located on a SOI-donor wafer. After the bond process, the SOI-donor wafer is grinded and spin etched to remove the handle silicon and the buried oxide layer, which results in a transfer of the mono-crystalline silicon membrane to the CMOS wafer. This technology is fully compatible for integration in a CMOS process, in order to fabricate SLMs, consisting of one million individually addressable mono-crystalline silicon micro-mirrors. The mirrors, presented here, have a size of 16×16 μm². Deflection is achieved by applying a voltage between the mirrors and the underlying electrodes of the CMOS electronics. In this paper, we will present the fabrication process as well as first investigations of the mirror properties.

Citation Download Citation

Fabian Zimmer, Frank Niklaus, Martin Lapisa, Thomas Ludewig, Martin Bring, Martin Friedrichs, Thor Bakke, Harald Schenk, and Wouter van der Wijngaart "Fabrication of large-scale monocrystalline silicon micro-mirror arrays using adhesive wafer transfer bonding", Proc. SPIE 7208, MOEMS and Miniaturized Systems VIII, 720807 (18 February 2009); https://doi.org/10.1117/12.808694

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available