Underlayer designs to enhance the performance of EUV resists

Hao Xu; James M. Blackwell; Todd R. Younkin; Ke Min

doi:10.1117/12.814223

1 April 2009 Underlayer designs to enhance the performance of EUV resists

Hao Xu, James M. Blackwell, Todd R. Younkin, Ke Min

Proceedings Volume 7273, Advances in Resist Materials and Processing Technology XXVI; 72731J (2009) https://doi.org/10.1117/12.814223
Event: SPIE Advanced Lithography, 2009, San Jose, California, United States

Abstract

Extreme ultraviolet (EUV) lithography has gained momentum as the method of choice for <32-nm half-pitch device fabrication. In this paper, we describe our initial attempts to increase an EUV resist's sensitivity without compromising resolution and line roughness via introduction of a thermally crosslinkable underlayer. The main purpose is to test the possibility of using a combination of photoacid generators (PAGs) and EUV sensitizers (phenol type) in the underlayer designs to enhance the overall performance of EUV resists. We have demonstrated the possible benefits of adding an EUV underlayer into the regular EUV litho stack and investigated the effect of PAG types and loadings on the photospeed and litho performance of three different EUV resists.

Citation Download Citation

Hao Xu, James M. Blackwell, Todd R. Younkin, and Ke Min "Underlayer designs to enhance the performance of EUV resists", Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72731J (1 April 2009); https://doi.org/10.1117/12.814223

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